Pressure sensor for evaporated fuel leak detector

ABSTRACT

A pressure sensor for an evaporated fuel leak detector is used for checking a leak in a fuel tank and a canister. The pressure sensor includes a sensor unit, a case, and a sealing resin. The sensor unit includes a pressure receiving portion for detecting a pressure of a fluid applied to a pressure receiving surface, and a mold resin portion covering a surface of the pressure receiving portion except for the pressure receiving surface. The case has a fluid flow path for introducing the fluid to the pressure receiving surface, and a housing recess in which the sensor unit is accommodated. The sealing resin is arranged in the housing recess, to at least cover a back surface of the mold resin portion located on an opposite side of the pressure receiving surface.

CROSS REFERENCE TO RELATED APPLICATION

The application is based on a Japanese Patent Application No.2020-063417 filed on Mar. 31, 2020, the contents of which areincorporated herein by reference in its entirety.

TECHNICAL FIELD

The present disclosure relates to a pressure sensor for an evaporatedfuel leak detector.

BACKGROUND

In a vehicle having an internal combustion engine, a hydrocarbon fuelsuch as gasoline, high octane, and light oil used as a liquid fuel inthe internal combustion engine is stored in a fuel tank. Evaporated fuelis generated in the fuel tank. In order not to release the evaporatedfuel to the outside, an evaporative fuel processing device having acanister capable of adsorbing the evaporated fuel is used, and apressure sensor is disposed.

SUMMARY

According to an embodiment of the present disclosure, a pressure sensoris for an evaporated fuel leak detector configured to detect a leak ofan evaporated fuel in an evaporative fuel processing device including afuel tank and a canister for adsorbing an evaporated fuel dischargedfrom the fuel tank. The pressure sensor includes a sensor unit, a caseand a sealing resin.

The sensor unit includes a pressure receiving portion configured todetect a pressure of a fluid applied to a pressure receiving surface,and a mold resin portion covering a surface of the pressure receivingportion except for the pressure receiving surface. The case is providedwith a fluid flow path through which the fluid is introduced to thepressure receiving surface, and a housing recess housing the sensor unitand connected to the fluid flow path. The sealing resin is arranged inthe housing recess to cover at least a back surface of the mold resinportion positioned at an opposite side of the pressure receivingsurface. Therefore, the pressure sensor is less susceptible toelectromagnetic noise and heat, and the factors that cause a detectionerror in the pressure sensor can be effectively reduced.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objects, features and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription with reference to the accompanying drawings. In theaccompanying drawings,

FIG. 1 is a diagram showing a configuration of a decompression leakcheck module using a pressure sensor and an evaporative fuel processingdevice according to a first embodiment;

FIG. 2 is a schematic cross-sectional view showing the pressure sensortaken along a cross section II-II of FIG. 4, according to the firstembodiment;

FIG. 3 is a schematic cross-sectional view showing the pressure sensortaken along a cross section III-III of FIG. 4, according to the firstembodiment;

FIG. 4 is a plane diagram showing the pressure sensor according to thefirst embodiment in a state where a sealing resin is not filled;

FIG. 5 is a schematic cross-sectional view showing a pressure sensortaken along a cross section V-V of FIG. 7, according to a secondembodiment;

FIG. 6 is a schematic cross-sectional view showing the pressure sensortaken along a cross section VI-VI of FIG. 7, according to the secondembodiment;

FIG. 7 is a plane diagram showing the pressure sensor according to thesecond embodiment in a state where a sealing resin is not filled;

FIG. 8 is an enlarged view showing a part of FIG. 5 according to thesecond embodiment;

FIG. 9 is an enlarged view showing another pressure sensor according tothe second embodiment;

FIG. 10 is an enlarged view showing another pressure sensor according tothe second embodiment;

FIG. 11 is a schematic cross-sectional view showing a pressure sensortaken along a cross section XI-XI of FIG. 13, according to a thirdembodiment;

FIG. 12 is a schematic cross-sectional view showing the pressure sensortaken along a cross section XII-XII of FIG. 13, according to the thirdembodiment;

FIG. 13 is a plane diagram showing the pressure sensor according to thethird embodiment in a state where a sealing resin is not filled;

FIG. 14 is an enlarged view showing a part of FIG. 11 according to thethird embodiment;

FIG. 15 is a schematic cross-sectional view showing a pressure sensortaken along a cross section XV-XV of FIG. 17, according to a fourthembodiment;

FIG. 16 is a schematic cross-sectional view showing the pressure sensortaken along a cross section XVI-XVI of FIG. 17, according to the fourthembodiment;

FIG. 17 is a plane diagram showing the pressure sensor according to thefourth embodiment in a state where a sealing resin is not filled; and

FIG. 18 is a plane diagram showing the pressure sensor according to thefourth embodiment in a state where a sensor unit and a sealing resin arenot filled.

DESCRIPTION OF EMBODIMENTS

In an evaporative fuel processing device, an evaporated fuel leakdetector for checking an airtightness of the fuel tank and the canisteris used. The evaporated fuel leak detector is provided with: a pressurereducing pump for decompressing the inside of the fuel tank and theinside of the canister; a solenoid valve configured to switch connectionof the gas phase of the canister to the atmosphere or the pressurereducing pump; and a pressure sensor disposed in a first pipe betweenthe pressure reducing pump and the solenoid valve to detect the pressurein the first pipe, pressure-reduced by the pressure reducing pump.

Further, a bypass pipe may be connected to the first pipe and a secondpipe between the canister and the solenoid valve to bypass the solenoidvalve, so that a predetermined leakage state is formed by an orificeprovided in the bypass pipe. Then, it is determined whether or not aleakage of the fuel tank and the canister is generated based on theleakage state from the orifice provided in the bypass pipe.

The pressure sensor and the like includes a sensor unit having apressure receiving portion, a case in which a housing recess foraccommodating a fluid flow path of the first pipe and the sensor unit isformed, and a sealing resin arranged in a gap of the housing recess inwhich the sensor unit is accommodated. The sensor unit is fixed to thehousing recess and the periphery of the sensor unit is sealed by thesealing resin, so that the pressure applied from the fluid flow path toa pressure receiving surface of a pressure receiving portion of thesensor unit is detected. The pressure receiving portion of the sensorunit converts the pressure applied to the pressure receiving surfaceinto strain, and a voltage change caused by the strain is detected.

In the above example, because the sealing resin arranged in the housingrecess is made to fix the sensor unit to the case, the sealing resin isnot arranged up to the back surface of the sensor unit located on anopposite side of the pressure receiving surface of the pressurereceiving portion. However, electromagnetic noise from a motor of thepressure reducing pump, a solenoid of the solenoid valve, or the likemay reach the back side of the sensor unit. In this case,electromagnetic noise may cause a detection error in the sensor unit. Inparticular, in recent years, as environmental regulations on theevaporated fuel and the like have become stricter, it is required tofurther improve the detection accuracy of airtightness check using apressure sensor.

The present disclosure has been made in view of the above matters, andis to provide a pressure sensor for an evaporated fuel leak detectorcapable of improving a detection accuracy.

According to an embodiment of the present disclosure, a pressure sensoris for an evaporated fuel leak detector configured to detect a leak ofan evaporated fuel in an evaporative fuel processing device including afuel tank and a canister for adsorbing an evaporated fuel dischargedfrom the fuel tank. The pressure sensor includes a sensor unit, a caseand a sealing resin.

The sensor unit includes a pressure receiving portion configured todetect a pressure of a fluid applied to a pressure receiving surface,and a mold resin portion covering a surface of the pressure receivingportion except for the pressure receiving surface. The case is providedwith a fluid flow path through which the fluid is introduced to thepressure receiving surface, and a housing recess housing the sensor unitand connected to the fluid flow path. The sealing resin is arranged inthe housing recess to cover at least a back surface of the mold resinportion positioned at an opposite side of the pressure receivingsurface.

In the pressure sensor of the evaporated fuel leak detector according tothe embodiment, the sealing resin arranged in the housing recess coversat least all the back surface of the mold resin portion of the sensorunit, which is located on an opposite side of the pressure receivingsurface. With this configuration, it is difficult for electromagneticnoises, generated from a motor of a pump and from a solenoid valvearranged around the pressure sensor, to reach to the sensor unit fromthe back side of the sensor unit. Further, it is possible to preventheat generated from the motor, the solenoid valve and the like fromreaching the sensor unit from the back side of the sensor unit.Therefore, the pressure sensor is less susceptible to electromagneticnoise and heat, and the factors that cause a detection error in thepressure sensor can be effectively reduced.

Thus, according to the pressure sensor of the evaporated fuel leakdetector, the pressure detection accuracy can be effectively improved.

Preferred embodiments of a pressure sensor for an evaporated fuel leakdetector will be described with reference to the drawings.

First Embodiment

As shown in FIG. 1, a pressure sensor 1 for an evaporated fuel leakdetector (hereinafter, simply referred to as “pressure sensor 1”) of thepresent embodiment is used for an evaporative fuel processing device 6that includes a fuel tank 61 and a canister 62 configured to adsorb anevaporated fuel discharged from the fuel tank 61. The evaporated fuelleak detector detects an evaporative fuel leak in the evaporative fuelprocessing device 6 including the fuel tank 61 and the canister 62, by aleak check. In other words, the evaporated fuel leak detector isconfigured to determine whether or not there is a possibility of a leakof evaporated fuel by using a leak check.

As shown in FIGS. 2 to 4, the pressure sensor 1 includes a sensor unit2, a case 3, and a sealing resin 4. The sensor unit 2 includes apressure receiving portion 21 for detecting a pressure of a fluid Rapplied to a pressure receiving surface 210, and a mold resin portion 22covering a surface of the pressure receiving portion 21 except for thepressure receiving surface 210. The case 3 includes a fluid flow path 31for introducing a fluid R to the pressure receiving surface 210, and ahousing recess 32 connected to the fluid flow path 31. The sensor unit 2is housed in the housing recess 32 of the case 3. The sealing resin 4 isarranged in the housing recess 32, and is configured to at least cover aback surface 223 of the mold resin portion 22 located on an oppositeside of the pressure receiving surface 210.

The pressure sensor 1 of a decompression leak check module 10 accordingto this embodiment will be described in detail below.

As shown in FIG. 1, the pressure sensor 1 is attached to the vehicleevaporative fuel processing device 6 having the fuel tank 61 and thecanister 62, and is a part of the decompression leak check module (ELCM)10 configured as the evaporated fuel leak detector to check a leak inthe fuel tank 61 and the canister 62. The decompression leak checkmodule 10 is provided with: a pressure reducing pump 51 fordecompressing the inside of the fuel tank 61 and the inside of thecanister 62 to be in a decompression state; a solenoid valve 52configured to switch a connection of the canister 62 to be connected toan atmosphere pipe 55 opened to the atmosphere or to be connected to thepressure reducing pump 51; and the pressure sensor 1 disposed to detecta pressure within a first pipe 53A. The inside of the first pipe 53A ispressure-reduced by the pressure reducing pump 51.

The pressure reducing pump 51, the solenoid valve 52, the pressuresensor 1, and the like are electrically connected to a controller 8. Thepressure sensor 1 is arranged in the first pipe 53A that connects thepressure reducing pump 51 and the solenoid valve 52. The canister 62 andthe solenoid valve 52 are connected by a second pipe 53B. A bypass pipe54 that bypasses the solenoid valve 52 is connected to the first pipe53A and the second pipe 53B. An orifice 541 is arranged in the bypasspipe 54.

The fuel tank 61 and the canister 62 are connected by a vapor pipe 63through which the evaporated fuel is discharged. The vapor pipe 63 maybe provided with a sealing valve 631 that opens the vapor pipe 63 whenthe evaporated fuel in the fuel tank 61 is discharged to the canister62. The canister 62 and an intake pipe 71 of an engine (internalcombustion engine) 7 are connected by a purge pipe 64. A purge valve 641is arranged in the purge pipe 64 to open the purge pipe 64 when the fuelcomponent is discharged from the canister 62 to the intake pipe 71.

The pressure reducing pump 51 is also called as a vacuum pump, and canevacuate the canister 62, the fuel tank 61, the first pipe 53A, thesecond pipe 53B, and the bypass pipe 54. When the fuel tank 61, thecanister 62 and the like are evacuated by the pressure reducing pump 51,the purge valve 641 of the purge pipe 64 is closed.

The solenoid valve 52 is made of an electromagnetic valve. The solenoidvalve 52 can be switched between an open position 521 that opens theinside of the canister 62 to the atmosphere and a pressure reducingposition 522 that connects the inside of the canister 62 to the pressurereducing pump 51. When the solenoid valve 52 is switched to the pressurereducing position 522, the first pipe 53A and the second pipe 53Bcommunicate with each other via the solenoid valve 52, so that the firstpipe 53A, the second pipe 53B and the bypass pipe 54 communicate witheach other.

The orifice 541 provided in the bypass pipe 54 is used to simulate apredetermined leak state indicating an upper limit value of a leakageallowable range in the path of evacuation by the pressure reducing pump51. The orifice 541 of this embodiment simulates a state in which a holehaving a diameter of 0.5 mm is formed in the path for evacuation. When apseudo leakage state is formed by the orifice 541, the solenoid valve 52is in the open position 521, and a path circulating from the pressurereducing pump 51 through the first pipe 53A, the solenoid valve 52, andthe bypass pipe 54 passing through the orifice 541 is vacuumed. Thus,the pressure is detected by the pressure sensor 1. In this state, thepressure detected by the pressure sensor 1 becomes the pressure of aleakage allowable reference value.

On the other hand, when a leakage detection is performed, the solenoidvalve 52 is at the pressure reducing position 522, so that the pressurereducing pump 51 evacuates the insides of the fuel tank 61, the canister62, and the like. At this time, if the pressure detected by the pressuresensor 1 is equal to or less than the leakage allowable reference value,it is determined that there is no leakage, and if the pressure detectedby the pressure sensor 1 exceeds the leakage allowable reference value,it is determined that there is leakage.

The solenoid valve 52 is normally located at the open position 521, andthe inside of the canister 62 can be kept at atmospheric pressure in anormal state.

Next, an evaporative fuel processing device 6 will be described.

As shown in FIG. 1, in the vehicle, the evaporative fuel processingdevice 6 is used such that the evaporated fuel, which is part of the gasin the fuel tank 61, is not released into atmosphere. The evaporatedfuel in the fuel tank 61 is stored in the canister 62 and thendischarged to the intake pipe 71 of the engine 7, or bypasses thecanister 62 and is discharged to the intake pipe 71 of the engine 7.Then, the fuel component of the evaporated fuel is used for thecombustion in the engine 7.

The flow rate of the combustion air A supplied from the intake pipe 71to the engine 7 is adjusted by operating the throttle valve 72 arrangedin the intake pipe 71. The engine 7 is provided with a fuel injectiondevice (not shown) that injects the fuel F supplied from the fuel tank61.

Next, the fuel tank 61 will be described.

As shown in FIG. 1, the fuel tank 61 stores the fuel F used for thecombustion operation of the engine 7. The fuel tank 61 includes a fuelsupply port 611, a vapor port 612, and a fuel pump (not shown). The fuelsupply port 611 is used to receive fuel F filled to the fuel tank 61from outside. The vapor port 612 is connected to the vapor pipe 63. Thefuel pump is used when supplying the fuel F to the fuel injection deviceof the engine 7. The fuel pump supplies the liquid phase fuel F of thefuel tank 61 to the fuel injection device.

A fuel cap 613 is disposed at the fuel supply port 611 of the fuel tank61, and closes the fuel supply port 611 during a normal operation. Thefuel cap 613 is removed during refueling to open the fuel supply port611. Further, the vehicle is provided with a fuel lid (not shown) thatcovers the fuel cap 613 during the normal operation. The fuel lidenables the operation of removing/attaching the fuel cap 613 during therefueling.

The canister 62 will be described.

As shown in FIG. 1, the canister 62 includes a canister case 621 and anadsorbent 622 such as activated carbon. The adsorbent 622 is disposed inthe canister case 621 and adsorbs the evaporated fuel (i.e., fuelvapor). The canister case 621 of the canister 62 includes an inlet 623,an outlet 624, and a pressure release port 625. The inlet 623 isconnected to the vapor pipe 63 and allows gas to enter. The outlet 624is connected to the purge pipe 64 and allows fuel components to exit.The pressure release port 625 is connected to the second pipe 53B andthe solenoid valve 52, so as to be open to the atmosphere. When theevaporated fuel (i.e., gas fuel) is discharged from the gas phase of thefuel tank 61 to the canister 62, and when the solenoid valve 52 is inthe open position 521, the pressure release port 625 is opened to theatmosphere through the atmosphere pipe 55. In the canister 62, the fuelcomponents in the evaporated fuel are adsorbed by the adsorbent 622,while the pressure in the canister 62 becomes equal to the atmosphericpressure.

The fuel components adsorbed by the adsorbent 622 of the canister 62pass through the purge pipe 64 and are discharged to the intake pipe 71of the engine 7. At this time, the solenoid valve 52 is in the openposition 521, the pressure release port 625 of the canister 62 is openedto the atmosphere, and the purge pipe 64 is opened by the purge valve641. The fuel components adsorbed by the adsorbent 622 are discharged tothe intake pipe 71 of the engine 7 by an airflow caused due to thepressure difference between the pressure of the atmosphere entering thecanister 62 through the pressure release port 625 and the negativepressure in the intake pipe 71.

Next, the sensor unit 2 of the pressure sensor 1 will be described.

As shown in FIGS. 2 and 3, the pressure receiving portion 21 of thesensor unit 2 is configured by using a piezoresistive semiconductor. Thepiezoresistive semiconductor utilizes the piezoresistive effect, whichis a phenomenon in which electrical resistance changes when a substanceis stressed. The pressure receiving portion 21 includes a circuitportion 211 in which a detection circuit such as a Wheatstone bridge isformed, and an insulating gel 212 around the circuit portion 211. Asensor terminal is drawn out from the circuit portion 211 to the outsideof the gel 212 and the mold resin.

In the present embodiment, in an axial direction L of the case 3, a sidewhere the pressure receiving surface 210 of the pressure receivingportion 21 is positioned is referred to as the pressure receiving sideL1, and a side opposite to the pressure receiving surface 210 isreferred to as a back side L2. In other words, the side of the housingrecess 32 where the pressure receiving surface 210 of the pressurereceiving portion 21 is arranged is referred to as the pressurereceiving side L1, and the side of the housing recess 32 opposite to thepressure receiving side L1 is referred to as the back side L2.

The mold resin portion 22 of the sensor unit 2 is made of athermoplastic resin or the like having an excellent heat resistance. Thepressure receiving surface 210 of the pressure receiving portion 21 isformed as a front surface of the pressure receiving portion 21, which isnot covered by the mold resin portion 22. The pressure receiving surface210 is located at a position recessed from a surface of the mold resinportion 22 to the back side L2. The mold resin portion 22 covers aportion of the pressure receiving portion 21 other than the frontsurface on which the pressure receiving surface 210 is located.

As shown in FIGS. 2 and 3, the mold resin portion 22 of the presentembodiment contains a noise removing capacitor 23 configured to removenoise (electromagnetic noise) that affects the pressure detection of thesensor unit 2. The capacitor 23 is made of a monolithic ceramiccapacitor or the like in which a plurality of electrodes and dielectricsare laminated. The capacitor 23 has a property of passing an alternatingcurrent while blocking a direct current. The capacitor 23 is configuredto remove AC component superimposed on the circuit unit 211 byconnecting the circuit portion 211 or the like of the pressure receivingportion 21 to the ground. The wirings of the circuit unit 211, thecapacitor 23 and the like are electrically connected to a plurality ofconduction terminals 213.

Next, the case 3 of the pressure sensor 1 will be described in detail.

As shown in FIGS. 2 and 3, the case 3 of the pressure sensor 1accommodates the sensor unit 2 and is configured to introduce a fluid Rinto the pressure receiving portion 21 of the sensor unit 2. The case 3is arranged in the decompression leak check module 10 that includes thepressure reducing pump 51, the solenoid valve 52 and the like as shownin FIG. 1. The fluid flow path 31 of the case 3 is formed along theaxial direction L of the case 3. The axial direction L of the case 3 isa direction perpendicular to the pressure receiving surface 210 of thepressure receiving portion 21 of the sensor unit 2. The pressure of thefluid R flowing through the fluid flow path 31 is applied to thepressure receiving surface 210 of the pressure receiving portion 21vertically from the fluid flow path 31.

The housing recess 32 of the case 3 is formed in a size thataccommodates the sensor unit 2. The housing recess 32 has a fittingportion 321 into which a pressure receiving portion 222A of the moldresin portion 22 of the sensor unit 2 is fitted, and a filling portion322 (step portion) connected to the fitting portion 321 to fill with thesealing resin 4. Further, between the fitting portion 321 and the fluidflow path 31, an enlarged flow path portion 311 is formed in which theflow of the fluid R flowing from the fluid flow path 31 to the pressurereceiving surface 210 of the pressure receiving portion 21 is enlarged.

The pressure receiving portion 222A positioned on the side surface 222of the mold resin portion 22, closer to the side where the pressurereceiving surface 210 is located, is fitted into the fitting portion 321of the housing recess 32. Because the mold resin portion 22 of thesensor unit 2 is fitted into the fitting portion 321, the sealing resin4 is prevented from entering the fluid flow path 31 when the sealingresin 4 is filled in the filling portion 322 of the housing recess 32.

As shown in FIGS. 3 and 4, an inner wall surface 323 defining thefilling portion 322 of the housing recess 32 is made of an inner wallsurface 323A on a conduction terminal side, and a remaining inner wallsurface 323B except for the inner wall surface 323A on the conductionterminal side. The inner wall surface 323A on the conduction terminalside is arranged on one direction of the housing recess 32 in a planeparallel to the pressure receiving surface 210 of the pressure receivingportion 21, and the remaining inner wall surfaces 323B is arranged onthe remaining three directions in the plane. At the end of the pressurereceiving side L1 of the inner wall surface 323A on the conductionterminal side, a bottom surface 324 parallel to the pressure receivingsurface 210 is formed, in a cross section along the axial direction Lperpendicular to the pressure receiving surface 210. The bottom surface324 is located between the side surface 222 of the mold resin portion 22of the sensor unit 2 and the inner wall surface 323A on the conductionterminal side, as shown in FIG. 3.

The case 3 is provided with a plurality of case-side terminals 33 thatcome into contact with the plurality of conduction terminals 213 and areconducted. The plurality of conduction terminals 213 of the pressurereceiving portion 21 of the sensor unit 2 are electrically connected toa power supply, the controller 8 and the like arranged outside thedecompression leak check module 10, via the plurality of case sideterminals 33.

As shown in FIG. 4, a chamfered portion 225 or a curved surface portion226 is formed at four corner portions in a plane parallel to thepressure receiving surface 210 of the pressure receiving portion 21, inthe mold resin portion 22 of the sensor unit 2. The inner wall surface323 of the housing recess 32 of the case 3 is formed in a shapecorresponding to the shape of the sensor unit 2 in a plane parallel tothe pressure receiving surface 210. A chamfered portion 323C or a curvedsurface portion 323D is formed at a corner portion of the threeremaining inner wall surfaces 323B on the inner wall surface 323 in aplane parallel to the pressure receiving surface 210. The remaininginner wall surface 323B is provided with the chamfered portion 323C andthe curved surface portion 323D.

The sealing resin 4 will be described.

As shown in FIGS. 2 and 3, the sealing resin 4 is made of athermosetting resin such as an epoxy resin. The sealing resin 4 is usedfor fixing the sensor unit 2 to the case 3 and for sealing the peripheryof the sensor unit 2. The sealing resin 4 is filled in the fillingportion 322 of the housing recess 32 after the sensor unit 2 is fittedin the fitting portion 321 of the housing recess 32 of the case 3. Thesensor unit 2 is covered entirely with the sealing resin 4 filled in thefilling portion 322 of the housing recess 32. In other words, when thesensor unit 2 is arranged in the housing recess 32, the mold resinportion 22 of the sensor unit 2 is exposed in the filling portion 322 ofthe housing recess 32, and then the surface of the mold resin portion 22is covered and sealed with the sealing resin 4.

The sealing resin 4 is filled in the filling portion 322 of the housingrecess 32 so as to cover the entire back surface 223 and the back sideportion 222B except for the pressure-receiving side portion 222A, in theside surface 222 of the mold resin portion 22 of the sensor unit 2. Withthis configuration, it is difficult for electromagnetic noise, heat,etc. generated from the equipment arranged around the pressure sensor 1to reach the pressure receiving portion 21 of the sensor unit 2.

A material of the pressure sensor 1 will be described.

In a comparative pressure sensor, the back surface of the sensor unit isexposed to the outside without being covered with a sealing resin. Inthe comparative pressure sensor, there may be two factors that make itdifficult to secure airtightness: peeling at the interface between themold resin portion of the sensor unit and the sealing resin, and peelingat the interface between the case and the sealing resin. Furthermore,because of the two types of interfaces, the peeling may be easilygenerated.

As shown in FIGS. 2 and 3, in the vicinity of the sensor unit 2 of thepressure sensor 1 of the present embodiment, because the sealing resin 4covers and seals the entire mold resin portion 22, the interface betweenthe mold resin portion 22 and the sealing resin 4 is not exposed to theoutside around the sensor unit 2. In this case, only the interfacebetween the case 3 and the sealing resin 4 is exposed to the outsidearound the sensor unit 2. As a result, the factor for securing theairtightness of the pressure sensor 1 due to peeling is only theinterface between the case 3 and the sealing resin 4.

In the present embodiment, because the capacitor 23 is incorporated intothe mold resin portion 22, a resin material having a small linearexpansion coefficient is intentionally used in order to approach thelinear expansion coefficient of the capacitor 23. Further, the sealingresin 4 of the embodiment is made by adding a filler (filler) as aninorganic material to a curable resin material, in order tointentionally lower the coefficient of linear expansion. In other words,the sealing resin 4 of the present embodiment contains a curable resinmaterial and a filler added to the resin material as an inorganicmaterial. The filler content in the sealing resin 4 is in a range of 40to 90%.

When the content ratio of the filler in the sealing resin 4 isincreased, the coefficient of linear expansion becomes low. For example,when the content of the filler in the sealing resin 4 is 40% by mass ormore, the coefficient of linear expansion can be effectively lowered. Onthe other hand, if the content of the filler in the sealing resin 4exceeds 90% by mass, the content of the filler becomes too large and theadhesiveness of the sealing resin 4 may deteriorate.

(Functions and Effects)

The pressure sensor 1 of the evaporated fuel leak detector of thisembodiment is used for the decompression leak check module 10. In thepressure sensor 1, the sealing resin 4 arranged in the housing recess 32covers the back side portion 222B in the side surface 222 of the moldresin portion 22 of the sensor unit 2 and all the back surface 223 ofthe mold resin portion 22. With this configuration, it is difficult forelectromagnetic noises generated from the motor of the pressure reducingpump 51 and the solenoid noise of the solenoid valve 52 arranged aroundthe pressure sensor 1 of the decompression leak check module 10, toreach the sensor unit 2 from the back side L2 of the sensor unit 2.Further, it is possible to prevent heat generated from the motor of thepressure reducing pump 51, the solenoid of the solenoid valve 52, andthe like from reaching the sensor unit 2 from the back side L2 of thesensor unit 2. Therefore, the pressure sensor 1 is less susceptible toelectromagnetic noise and heat, and the factors that cause a detectionerror in the pressure sensor 1 can be effectively reduced.

Therefore, according to the pressure sensor 1 of the evaporated fuelleak detector of this embodiment, the pressure detection accuracy can beimproved.

Second Embodiment

A pressure sensor 1 of the present embodiment is different from that ofthe first embodiment, particularly in the shape of the case 3. As shownin FIGS. 5 to 7, the pressure sensor 1 of the second embodiment alsoincludes a sensor unit 2, a case 3, and a sealing resin 4. The sensorunit 2 includes a pressure receiving portion 21 configured to detect thepressure of the fluid R applied to the pressure receiving surface 210, aplurality of conductive terminals 213 provided at the pressure receivingportion 21 and made of a conductive material, and a mold resin portion22 that covers the outer surface of the pressure receiving portion 21except for the pressure receiving surface 210. The basic configurationsof the case 3 and the sealing resin 4 are similar to those of the firstembodiment, and the explanation of the same portions is omittedpartially or entirely.

The annular inner wall surface 323 that surrounds the side surface 222of the mold resin portion 22 and defines the housing recess 32 is madeof the conductive terminal-side inner wall surface 323A and theremaining inner wall surfaces 323B, similarly to the structure of thefirst embodiment. When the residual inner wall surface 323B is viewed ina cross section along the axial direction L perpendicular to thepressure receiving surface 210, the residual inner wall surface 323B isprovided with a parallel stepped surface 326 that is parallel to thepressure receiving surface 210, as shown in FIG. 8.

As shown in FIG. 8, the parallel stepped surface 326 is configured toprevent the peeling, which occurs at the exposed position of the backside L2 of the interface between the remaining inner wall surface 323Bof the housing recess 32 and the sealing resin 4, from further extendingto the pressure receiving side L1. As shown in FIGS. 7 and 8, theparallel stepped surface 326 is formed on the remaining inner wallsurfaces 323B arranged on three directions in a plane parallel to thepressure receiving surface 210, among the inner wall surface 323 of thehousing recess 32. The parallel stepped surface 326 of each remaininginner wall surface 323B is formed to be parallel to the pressurereceiving surface 210.

As shown in FIGS. 5 and 6, all the parallel stepped surface 326 of eachremaining inner wall surface 323B is positioned on the back side L2compared to the tip of the back surface 223 positioned on the back sideL2 in the mold resin portion 22. Further, the sealing resin 4 is filledup to a position of the back side L2 more than the parallel steppedsurface 326 of each remaining inner wall surface 323B in the housingrecess 32. In other words, the surface 41 of the back side L2 of thesealing resin 4 is located on the back side L2 more than the parallelstepped surface 326 of each remaining inner wall surface 323B.

By filling the sealing resin 4 to the position of the back side L2 morethan the parallel stepped surface 326, the thickness of the sealingresin 4 arranged on the back side L2 of the mold resin portion 22 can bemade equal to or more than a certain thickness. If the parallel steppedsurface 326 is used as a mark for the filling position of the sealingresin 4, and the entire parallel stepped surface 326 is buried in thesealing resin 4, the thickness of the sealing resin 4 can be set at acertain thickness or more.

As shown in FIG. 8, in the cross section along the axial direction Lperpendicular to the pressure receiving surface 210, the remaining innerwall surface 323B of the present embodiment is provided with a firstvertical surface 325, the parallel stepped surface 326, an inclinedsurface 327 and a second vertical surface 328 in this order from theopening side of the housing recess 32. The opening side of the housingrecess 32 corresponds to the back side L2 of the axial direction L. Thefirst vertical surface 325 is located on the most back side L2 of eachremaining inner wall surface 323B and is formed perpendicular to thepressure receiving surface 210. The parallel stepped surface 326 isformed adjacent to an end of the pressure receiving side L1 of the firstvertical surface 325 in each remaining inner wall surface 323B.

The inclined surface 327 is formed so as to be adjacent to an end of theparallel stepped surface 326 of each remaining inner wall surface 323Band to be positioned inward as toward the pressure receiving side L1, asshown in FIG. 8. The inward means the center side of the housing recess32 in the plane of the pressure receiving surface 210. The inclinedsurface 327 serves as a guide surface when the sensor unit 2 is fittedinto the fitting portion 321 of the housing recess 32. The inclinedsurface 327 may be formed in a short range as shown in FIG. 8, or may beformed in a size that appropriately guides the fitting of the sensorunit 2 as shown in FIG. 9.

As shown in FIGS. 8 and 9, the second vertical surface 328 is formedperpendicular to the pressure receiving surface 210 adjacent to an endof the pressure receiving side L1 of the inclined surface 327, in eachof the remaining inner wall surfaces 323B. The second vertical surface328 is provided to define a filling gap 34 filled with the sealing resin4 between the second vertical surface 328 and the side surface 222 ofthe mold resin portion 22. In other words, the filling gap 34 filledwith the sealing resin 4 is formed between the second vertical surface328 and the side surface 222 of the mold resin portion 22. Further, asshown in FIG. 6, the inner wall surface 323A on the conduction terminalside is formed perpendicular to the pressure receiving surface 210without a step portion, for example.

(Functions and Effects)

In the pressure sensor 1 of the evaporated fuel leak detector of thepresent embodiment, the sealing resin 4 filled in the housing recess 32covers a surface portion of the mold resin portion 22 arranged in thehousing recess 32. That is, the sealing resin 4 covers entirely the backside portion 222B of the side surface 222 of the mold resin portion 22and the back surface 223 of the mold resin portion 22. With thisconfiguration, in the periphery of the sensor unit 2, the interfacebetween the mold resin portion 22 of the sensor unit 2 and the sealingresin 4 is not exposed to the outside, and only the interface betweenthe case 3 and the sealing resin 4 is exposed to the outside.

The parallel stepped surface 326 is formed on the three remaining innerwall surfaces 323B except for the inner wall surface 323A on theconduction terminal side, which form the housing recess 32 to surroundthe side surface 222 of the mold resin portion 22 of the sensor unit 2.With this configuration, even if peeling occurs at the interface betweenthe first vertical surface 325 of the remaining inner wall surface 323Bof the case 3 and the sealing resin 4 facing the first vertical surface325, the parallel stepped surface 326 can prevent this peeling frombeing extended.

In FIG. 8, a case where peeling occurs at the interface between thefirst vertical surface 325 and the sealing resin 4 is shown by thealternate long and short dash line X. In this case, although the sealingresin 4 is separated from the first vertical surface 325 by peeling, theamount of the sealing resin 4 separated from the first vertical surface325 becomes smaller as toward the pressure receiving side L1. When thesealing resin 4 tries to separate from the first vertical surface 325 ina direction parallel to the pressure receiving surface 210 of thepressure receiving portion 21 (i.e., the direction perpendicular to theaxial direction L), the sealing resin 4 facing the parallel steppedsurface 326 is in a state difficult to be separated from the parallelstepped surface 326. As a result, even if peeling occurs between thefirst vertical surface 325 and the sealing resin 4, the extension ofthis peeling can be prevented by the parallel stepped surface 326.

Therefore, according to the pressure sensor 1 of the evaporated fuelleak detector of the present embodiment, the spread of peeling at theinterface between the first vertical surface 325 and the sealing resin 4can be prevented, and the airtightness of the pressure sensor 1 can besufficiently improved.

Next, an inclined stepped surface 326X shown in FIG. 10 will bedescribed.

In the example shown in FIG. 10, instead of the parallel stepped surface326 on each remaining inner wall surface 323B of FIG. 8, an inclinedstepped surface 326X having an internal angle θ of less than 90°inclined with respect to the pressure receiving surface 210 may beformed. The internal angle θ is an angle between the first verticalsurface 325 and the inclined stepped surface 326X. Because anacute-angled internal angle θ is formed between the first verticalsurface 325 and the inclined stepped surface 326X, it can prevent thegenerated peeling between the first vertical surface 325 and the sealingresin 4 from progressing toward the pressure receiving side L1, as inthe parallel stepped surface 326.

In each remaining inner wall surface 323B of the housing recess 32, theinclined surface 327 may not be formed between the first verticalsurface 325 and the parallel stepped surface 326. For example, the firstvertical surface 325, the parallel stepped surface 326, and the secondvertical surface 328 may be formed in this order from the back side L2of the housing recess 32. Even in this case, the effect of preventingthe peeling extension due to the parallel stepped surface 326 can beobtained. Furthermore, the inclined stepped surface 326X may be usedinstead of the parallel stepped surface 326.

Further, the parallel stepped surface 326 or the inclined steppedsurface 326X may be formed in the inner wall surface 323A on theconduction terminal side. Thus, even when peeling occurs at theinterface between the inner wall surface 323A on the conduction terminalside and the sealing resin 4, the extension of the peeling can beprevented by the parallel stepped surface 326 or the inclined steppedsurface 326X. The parallel stepped surface 326 or the inclined steppedsurface 326X may be formed only in a part of the remaining inner wallsurface 323B.

Other configurations, functions and effects of the evaporative fuelprocessing device 1 of the present embodiment are the same as those ofthe first embodiment. In the above second embodiment, componentsindicated by the same reference numerals as those in the firstembodiment may have the same structures as those in the firstembodiment.

Third Embodiment

A pressure sensor 1 of the third embodiment is different from that ofthe first or second embodiment, particularly in the shape of the case 3.As shown in FIGS. 11 to 13, the pressure sensor 1 of the thirdembodiment also includes a sensor unit 2, a case 3, and a sealing resin4. Each remaining inner wall surface 323B of a housing recess 32 of thepresent embodiment is provided with a first vertical surface 325, aninclined surface 327 and a second vertical surface 328 in this order, inthe cross section along the axial direction L perpendicular to thepressure receiving surface 210. The inclined surface 327 is inclinedinward as toward the pressure receiving side L1. The second verticalsurface 328 extends from the end the pressure receiving side L1 of theinclined surface 327 to define a filling gap 34 in which the sealingresin 4 is filled between the side surface 222 of the mold resin portion22 and the second vertical surface 328. The inclined surface 327 and thesecond vertical surface 328 are formed on a plurality of remaining innerwall surfaces 323B that intersect each other.

The filling gap 34 may be formed to have a regular thickness in adistance of the axial direction L between the pressure receiving side L1and the back side L2, so that an amount of change in thickness is withina range of, for example, 0.5 mm. Further, the filling gap 34 may beformed within a thickness range of, for example, 0.5 to 2 mm.

In the present embodiment, as shown in FIG. 14, in the cross sectionalong the axial direction L perpendicular to the pressure receivingsurface 210, an end portion 327A of the inclined surface 327 on thepressure receiving side L1 is positioned at the back side L2 of theouter edge portion 224 that is parallel to pressure receiving surface210 of the mold resin portion 22 in the axial direction L. Thedifference between the positions of the end portion 327A and the outeredge portion 224 in the axial direction L is indicated by referencenumeral S. As a result, when the mold resin portion 22 of the sensorunit 2 is fitted into the fitting portion 321 of the housing recess 32,the mold resin portion 22 is fitted into the fitting portion 321 afterbeing guided to a regular fitting position by the inclined surface 327.

The sealing resin 4 is filled up to the back side L2 more than an endportion 327B on the back side L2 of the inclined surface 327 of eachremaining inner wall surface 323B. In other words, the outer surface ofthe sealing resin 4 is located on the back side L2 more than the endportion 327B on the back side L2 of the inclined surface 327. The entireinclined surface 327 of each remaining inner wall surface 323B isembedded in the sealing resin 4.

Further, as shown in FIGS. 11 and 12, the sealing resin 4 covers theentire back surface 223 of the mold resin portion 22 and the entire backside portion 222B of the side surface 222 of the mold resin portion 22,except for the pressure-receiving side portion 222A in the side surface222 of the mold resin portion 22. By filling the sealing resin 4 to theposition of the back side L2 more than the inclined surface, thethickness of the sealing resin 4 arranged on the back side L2 of themold resin portion 22 can be made equal to or more than a certainthickness.

As shown in FIG. 14, in the cross section along the axial direction Lperpendicular to the pressure receiving surface 210, the remaining innerwall surface 323B of the receiving recess 32 of the present embodimentis provided with the first vertical surface 325, the inclined surface327 and the second vertical surface 328 in this order from the back sideL2 of the receiving recess 32. The configurations of the first verticalsurface 325, the inclined surface 327, and the second vertical surface328 are similar to those of the second embodiment. However, a parallelstepped surface 326 or an inclined stepped surface 326X may be formedbetween the first vertical surface 325 and the inclined surface 327, asin the example shown in FIGS. 8 to 10.

(Functions and Effects)

In the pressure sensor 1 of the evaporated fuel leak detector of thepresent embodiment, the sealing resin 4 filled in the housing recess 32covers a surface portion of the mold resin portion 22 arranged in thehousing recess 32. That is, the sealing resin 4 covers entirely the backside portion 222B of the side surface 222 of the mold resin portion 22and the back surface 223 of the mold resin portion 22. With thisconfiguration, it is difficult for electromagnetic noises or heatgenerated from the motor of the pressure reducing pump 51 and thesolenoid noise of the solenoid valve 52 arranged around the pressuresensor 1 of the decompression leak check module 10, to reach to thesensor unit 2 from the back side L2 of the sensor unit 2.

Each remaining inner wall surface 323B of the housing recess 32 of thepresent embodiment is provided with the first vertical surface 325, theinclined surface 327 and the second vertical surface 328 in this order,in the cross section along the axial direction L perpendicular to thepressure receiving surface 210. The inclined surface 327 is inclinedinward as toward the pressure receiving side L1. The second verticalsurface 328 extends from the end of the pressure receiving side L1 ofthe inclined surface 327 to define the filling gap 34 in which thesealing resin 4 is filled between the side surface 222 of the mold resinportion 22 and the second vertical surface 328. With this configuration,the thickness of the sealing resin 4 filled in the filling gap 34between the side surface 222 of the mold resin portion 22 and the secondvertical surface 328 is made substantially uniform in the axialdirection L between the pressure receiving side L1 and the back side L2.

In FIG. 14, the thickness of the sealing resin 4 filled in the fillinggap 34 is slightly changed in the axial direction L due to the taperedshape of the back side portion 222B of the side surface 222 of the moldresin portion 22. However, in this case, the amount of change in thethickness of the sealing resin 4 filled in the filling gap 34 is smallerthan the amount of change in the width of the sealing resin 4 due to theinclination angle of the inclined surface 327.

Due to the configuration in which the thickness of the sealing resin 4filled in the filling gap 34 is substantially uniform, the thermalstress applied to the direction perpendicular to the axial direction Lfrom the sealing resin 4 to the sensor unit 2 is substantially uniformat each portion in the axial direction L when the pressure sensor 1 isheated or cooled.

In this embodiment, the coefficient of linear expansion of the sealingresin 4 is made larger than the coefficient of linear expansion of themold resin portion 22 of the sensor unit 2. When the pressure sensor 1is heated, the expansion amount of the sealing resin 4 becomes largerthan the expansion amount of the mold resin portion 22, so that thermalstress is applied to the sensor unit 2 including the pressure receivingportion 21 and the mold resin portion 22, from the sealing resin 4filled in the filling gap 34. At this time, the thermal stress isproportional to the thickness of the sealing resin 4. However, in thepresent embodiment, by making the thickness of the sealing resin 4filled in the filling gap 34 substantially uniform, the thermal stressacting on the sensor unit 2 from the sealing resin 4 can be madesubstantially uniform. In this way, because the thermal stress appliedto the sensor unit 2 becomes substantially uniform, it can preventnon-uniform deformation from being generated in the sensor unit 2.

Therefore, according to the pressure sensor 1 of the evaporated fuelleak detector of the present embodiment, the stress acting on thepressure receiving unit 21 due to the deformation of the sensor unit 2can be reduced, and the pressure detection at the pressure receivingunit 21 can be accurately performed.

Further, the inclined surface 327 and the vertical surface 328 may beformed at least on the two remaining inner wall surfaces 323Bperpendicular to each other, so as to effectively guide the sensor unit2 into the fitting portion 321 of the housing recess 32 using theinclined surface 327. If the two inclined surfaces 327 are provided inthe remaining inner wall surface 323B perpendicular to each other, theposition of the sensor unit 2 with respect to the fitting portion 321can be adjusted to be positioned in the plane parallel to the pressurereceiving surface 210.

Other configurations, functions and effects of the pressure sensor 1 ofthe present embodiment are the similar to those of the first or secondembodiment. In the above third embodiment, components indicated by thesame reference numerals as those in the first or second embodiment mayhave the same structures as those in the first or second embodiment.

Fourth Embodiment

A pressure sensor 1 of the fourth embodiment is different from that ofthe first to third embodiments, particularly in the shape of the case 3.As shown in FIGS. 15 to 18, the pressure sensor 1 of the fourthembodiment also includes a sensor unit 2, a case 3, and a sealing resin4. A buffer recess 35 having an outer shape larger than the outer shapeof the pressure receiving surface 210 is formed at the pressurereceiving side L1 of the bottom of the housing recess 32 of the presentembodiment. The buffer recess 35 is continuously formed at the pressurereceiving side L1 of the housing recess 32, and is arranged on thepressure receiving side L1 rather than the sensor unit 2 in a statewhere the sensor unit 2 is fitted in the fitting portion 321 of thehousing recess 32.

As shown in FIGS. 15, 16 and 18, a protruding cylinder portion 36protruding into the buffer recess 35 toward the back side L2 is formedat an outer edge of an opening end portion of the fluid flow path 31 onthe back side L2. The buffer recess 35 is formed in an annular shapearound the protruding cylinder portion 36. The housing recess 32 may bedeeply formed to be more deeply recessed on the pressure receiving sideL1 to have the buffer recess 35 so as to form the protruding cylinderportion 36 on the outer edge of the open end portion of the fluid flowpath 31 on the back side L2. The protruding cylinder portion 36 has atubular shape, and the fluid flow path 31 is formed longer on the backside L2 by the amount of the protruding cylinder portion 36 formed.

As shown in FIGS. 15 and 18, a bottom surface 351 facing the mold resinportion 22 of the sensor unit 2 is formed at a position of the bottomportion of the pressure receiving side L1 of the housing recess 32 wherethe buffer recess 35 is not formed. The buffer recess 35 can be formedinto various shapes around the protruding cylinder portion 36.

As shown in FIGS. 15 and 16, the pressure receiving surface 210 of thepressure receiving portion 21 of the sensor unit 2 is positioned on theback side L2 from the end surface 221 of the pressure receiving side L1of the mold resin portion 22. Then, the pressure receiving surface 210of the pressure receiving portion 21 is in a state of being drawn andrecessed into the mold resin portion 22 toward the back side L2.Further, the pressure receiving portion 21 is surrounded and protectedby the mold resin portion 22.

A fluid passage gap 37 through which the fluid R passes is formedbetween the end of the back side L2 of the protruding cylinder portion36 and the end surface 221 of the pressure receiving side L1 of thesensor unit 2. The dimension (i.e., width) of the fluid passage gap 37in the axial direction L is smaller than the depth from the end surface221 of the pressure receiving side L1 of the mold resin portion 22 tothe bottom surface of the pressure receiving side L1 of the bufferrecess 35 due to the formation of the protruding cylinder portion 36.

As shown in FIGS. 15 to 17 of the present embodiment, a fitting gap 39is provided between the periphery of the end portion of the pressurereceiving side L1 of the mold resin portion 22 and the remaining innerwall surfaces 323B of the housing recess 32 on the three-way directions.The pressure-receiving side portion 222A of the mold resin portion 22 isguided by a convex portion 38 formed in the fitting portion 321 of thehousing recess 32, and is fitted into the fitting portion 321 of thehousing recess 32. It is easy to change the shape of the convex portion38 by adjusting a shape of a molding die for molding the case 3.Therefore, the size of the fitting gap 39 can be easily adjusted.

(Functions and Effects)

In the pressure sensor 1 of the evaporated fuel leak detector of thisembodiment, a buffer recess 35 is formed at the pressure receiving sideL1 of the bottom of the housing recess 32, and is positioned between thehousing recess 32 and the fluid flow path 31. Further, the protrudingcylinder portion 36 protruding into the buffer recess 35 toward the backside L2 is formed at an outer edge of the opening end portion of thefluid flow path 31 on the back side L2.

When the sealing resin 4 is filled in the housing recess 32 in which thesensor unit 2 is arranged, a part of the sealing resin 4 may flow fromthe housing recess 32 toward the fluid flow path 31 through the fittinggap 39. Even in this case, a part of the sealing resin 4 is blocked bythe protruding cylinder portion 36, and a part of the sealing resin 4can be stored in the buffer recess 35. As a result, it can prevent apart of the sealing resin 4 from flowing out to the fluid flow path 31.

If a part of the sealing resin 4 flows into the fluid flow path 31, theair flow resistance of the fluid flow path 31 increases, and theresponsiveness of detection by the pressure sensor 1 may decrease.Further, in this case, the orifice 541 may be blocked by a part of thesealing resin 4. Thus, the detection accuracy of the leak check of thedecompression leak check module 10 may reduce.

In the present embodiment, because the sealing resin 4 can be stored inthe buffer recess 35, the detection accuracy of the leak check of thedecompression leak check module 10 can be effectively improved. It canprevent the orifice 541 from being blocked by the sealing resin 4flowing from the receiving recess 32 toward the fluid flow path 31, andit can prevent the sealing resin from adhering to the pressure receivingsurface 210 of the pressure receiving portion 21. As a result, theresponding ability of the pressure sensor 1 can be improved, and thedetection error of the pressure sensor 1 can be effectively prevented.Thus, the detection accuracy of the leak check of the decompression leakcheck module 10 can be improved. Further, because the sealing resin 4can be stored in the buffer recess 35, a certain amount of the sealingresin 4 can be allowed to flow out from the housing recess 32 to a sideof the fluid flow path 31.

In the present embodiment, because the pressure-receiving side portion222A in the side surface 222 of the mold resin portion 22 is fitted intothe housing recess 32, it is unnecessary to use a concave-convex fittingstructure between the mold resin portion 22 and the housing recess 32.As a result, a damage of the mold resin portion 22 can be effectivelyprevented.

Therefore, according to the pressure sensor 1 of the evaporated fuelleak detector of the present embodiment, the mold resin portion 22 ofthe sensor unit 2 can be protected, and the pressure can be accuratelydetected even when the sealing resin 4 flows out from the housing recess32.

Other configurations, functions and effects of the pressure sensor 1 ofthe present embodiment are the similar to those of the first to thirdembodiment. In the above fourth embodiment, components indicated by thesame reference numerals as those in the first to third embodiments mayhave the same structures as those in the first to third embodiments.

In the first to fourth embodiments, a pressure sensor 1 is applied tothe decompression leak check module 10. In addition to this, thepressure sensor 1 may be applied to a positive pressure leak checkmodule that performs a leak check in a pressurized state.

The present embodiment has been described above with reference to thespecific examples. However, the present disclosure is not limited tothese specific examples. Modifications or changes made by a personskilled in the art to these specific examples as appropriate areincluded in the scope of the present disclosure as long as they have thefeatures of the present disclosure. Each element included in therespective specific examples described above and the arrangement,conditions, shape, and the like of these elements are not limited tothose exemplified and can be changed as appropriate. The respectiveelements included in the specific examples described above can beappropriately combined together as long as there occurs no technicalcontradiction between them.

What is claimed is:
 1. A pressure sensor for an evaporated fuel leakdetector configured to detect a leak of an evaporated fuel in anevaporative fuel processing device including a fuel tank and a canisterfor adsorbing an evaporated fuel discharged from the fuel tank, thepressure sensor comprising: a sensor unit including a pressure receivingportion configured to detect a pressure of a fluid applied to a pressurereceiving surface, and a mold resin portion covering a surface of thepressure receiving portion except for the pressure receiving surface; acase provided with a fluid flow path through which the fluid isintroduced to the pressure receiving surface, and a housing recesshousing the sensor unit and connected to the fluid flow path; and asealing resin arranged in the housing recess and covering at least aback surface of the mold resin portion of the sensor unit, positioned atan opposite side of the pressure receiving surface in the sensor unit.2. The pressure sensor according to claim 1, wherein a side surface ofthe mold resin portion is made of a pressure-receiving side portionadjacent to the pressure receiving surface, and a back side portionexcept for the pressure-receiving side portion, the pressure-receivingside portion of the side surface of the mold resin portion is fittedinto the housing recess, and the sealing resin is filled in the housingrecess to entirely cover the back side portion and the back surface ofthe sensor unit.
 3. The pressure sensor according to claim 1, furthercomprising a noise removing capacitor disposed within the mold resinportion to remove noise affecting a pressure detection of the sensorunit.
 4. The pressure sensor according to claim 1, wherein the sealingresin contains a curable resin material, and a filler added to the resinmaterial as an inorganic material, and a content ratio of the filler inthe sealing resin is in a range of 40 to 90%.
 5. The pressure sensoraccording to claim 1, wherein the sealing resin is arranged to cover allthe back surface of the mold resin portion and a part of a side surfaceof the mold resin portion, adjacent to the back surface of the moldresin portion.